arXiv:2604. 26633v2 Announce Type: replace-cross Abstract: Industrial surface defect inspection suffers from a fundamental data bottleneck: defects are rare, annotations require expert knowledge, and collecting balanced training sets is slow and costly.
By Paul Julius K\"uhn, Mika Pommeranz, Arjan Kuijper, Saptarshi Neil Sinha
The paper introduces ISP-AD, the largest publicly available industrial anomaly detection dataset, featuring both synthetic and real defects from a factory floor. It focuses on challenging, small, weakly contrasted surface defects within highly variable structured patterns, addressing the bias of existing datasets toward ideal imaging conditions. Experiments demonstrate that even a small amount of weakly labeled real defects improves model generalization and that synthetic defects can serve as a useful cold‑start baseline for scalable training.
By Paul J. Krassnig, Dieter P. Gruber
This paper presents the IEEE International Conference on Multimedia and Expo (ICME) 2026 Grand Challenge on Cross-Scenario Defect Detection and Fine-Grained Severity Grading for High-Precision Manufacturing. The challenge is motivated by two key limitations of existing industrial defect inspection systems: (1) current deep learning-based methods often suffer significant performance degradation when deployed in unseen production scenarios, and (2) most benchmarks neglect severity-aware assessment, which is critical for risk control and yield optimization.
The paper introduces an automated defect detection system for printed circuit board (PCB) pin insertion, combining U‑Net semantic segmentation with contour‑based feature extraction and logistic regression for board‑level pass/fail classification. Segmentation masks generate contour representations of individual pins, from which features such as average contour size are extracted to train the classifier. Evaluated on an industrial dataset and a public PCB pin‑inspection dataset, the method achieved ROC‑AUC scores of 0.990 and 1.000, outperforming PatchCore and instance‑segmentation baselines.
By Nils Rabeneck, Andr\'e Kiunke, Nicole Hoess, Wolfgang Mauerer
arXiv:2606. 08908v1 Announce Type: cross Abstract: Semiconductor lithography inspection requires reliable detection of small pattern defects such as bridge, burr, pinch, and contamination.
By Pangyun Jeong, Jiyeong Kong, Yuehua Hu, Dohee Jeong, Kyung-Tae Kang
arXiv:2607. 12245v1 Announce Type: cross Abstract: Few-shot industrial defect detection remains difficult for standard supervised detectors, which achieve poor performance on boundary-dominated industrial defects.
By Jiaqi Kuang