arXiv:2606. 08908v1 Announce Type: cross Abstract: Semiconductor lithography inspection requires reliable detection of small pattern defects such as bridge, burr, pinch, and contamination.
Summary generated by The Flow from the publisher's feed. The full article lives at arXiv AI.
arXiv:2604. 26633v2 Announce Type: replace-cross Abstract: Industrial surface defect inspection suffers from a fundamental data bottleneck: defects are rare, annotations require expert knowledge, and collecting balanced training sets is slow and costly.
arXiv:2607. 10826v1 Announce Type: cross Abstract: Automated evaluation is essential for scaling generative 3D systems, where exhaustive human review is costly and slow.
Despite generating increasingly photorealistic images, text-to-image (T2I) models still exhibit localized, subtle, and structurally complex failures. Diagnosing these failures requires instance-level feedback that answers where a defect occurs, what type it is, why it is defective, and its importance to overall image quality.
Automated evaluation is essential for scaling generative 3D systems, where exhaustive human review is costly and slow. However, the reliability of an automated judge depends on the entire evaluation pipeline, not only the underlying vision-language model (VLM), but also how assets are rendered, what visual evidence is provided, how the task is specified, and how human reference labels are constructed.
This paper presents the IEEE International Conference on Multimedia and Expo (ICME) 2026 Grand Challenge on Cross-Scenario Defect Detection and Fine-Grained Severity Grading for High-Precision Manufacturing. The challenge is motivated by two key limitations of existing industrial defect inspection systems: (1) current deep learning-based methods often suffer significant performance degradation when deployed in unseen production scenarios, and (2) most benchmarks neglect severity-aware assessment, which is critical for risk control and yield optimization.
arXiv:2606. 00852v1 Announce Type: cross Abstract: Printed circuit board (PCB) defect detection is challenging because many defects are small and difficult to distinguish from complex background patterns.