arXiv:2606. 24046v1 Announce Type: cross Abstract: This work presents a machine learning framework that leverages an autoencoder (AE) for the efficient modeling of FinFET.
By Amit Sarkar Suman Sau, Swagata Mandal
arXiv:2607. 05187v1 Announce Type: new Abstract: As CMOS technology scales into the deep nanometer regime, digital circuit reliability is increasingly threatened by the combined stochastic effects of Bias Temperature Instability (BTI) and Process Variation (PV).
By Arash Esshaghi, Siavash Es'haghi, Gholamreza Shahabadi, Alireza Moradi
arXiv:2608. 08048v1 Announce Type: cross Abstract: This paper presents, for the first time in power systems literature to our knowledge, analytical tools to explain the training performance of machine learning surrogate models for power system dynamics.
By Petros Ellinas, Johanna Vorwerk, Spyros Chatzivasileiadis
arXiv:2608. 16080v1 Announce Type: new Abstract: Thermal-aware optimization of multi-die 3D integrated circuits evaluates many designs, each a costly heat-equation solve.
By Xinling Yu, Yixing Li, Ziyue Liu, Xin Ai, Zhiyu Zeng, Hai Li, Zheng Zhang
As CMOS technology scales into the deep nanometer regime, digital circuit reliability is increasingly threatened by the combined stochastic effects of Bias Temperature Instability (BTI) and Process Variation (PV). Traditional reliability analysis methods, which rely on computationally intensive simulations or extensive lookup tables, fail to scale efficiently for large designs, creating a critical bottleneck in design space exploration.
arXiv:2504. 03711v2 Announce Type: replace-cross Abstract: Artificial intelligence (AI)-driven electronic design automation (EDA) techniques have been extensively explored for VLSI circuit design applications.
By Wenji Fang, Jing Wang, Yao Lu, Shang Liu, Yuchao Wu, Yuzhe Ma, Zhiyao Xie