arXiv:2608. 09622v1 Announce Type: new Abstract: Reliability qualification of advanced semiconductor devices requires sequential stress decisions that balance characterization objectives against multiple competing failure mechanisms.
Summary generated by The Flow from the publisher's feed. The full article lives at arXiv AI.
The rapid growth of chiplet-based artificial intelligence systems-on-chip (SoCs) has exposed a fundamental gap in semiconductor test methodology. Existing Known Good Die (KGD) screening guarantees pre-assembly functional correctness, yet it offers no probabilistic assurance of post-assembly reliability lifetime.
arXiv:2607. 20141v1 Announce Type: cross Abstract: The rapid growth of chiplet-based artificial intelligence systems-on-chip (SoCs) has exposed a fundamental gap in semiconductor test methodology.
arXiv:2607. 05187v1 Announce Type: new Abstract: As CMOS technology scales into the deep nanometer regime, digital circuit reliability is increasingly threatened by the combined stochastic effects of Bias Temperature Instability (BTI) and Process Variation (PV).
arXiv:2605. 00868v3 Announce Type: replace-cross Abstract: Ultra-wide bandgap (UWBG) Ga$_2$O$_3$ is a promising semiconductor for high-power and high-temperature electronics.
As CMOS technology scales into the deep nanometer regime, digital circuit reliability is increasingly threatened by the combined stochastic effects of Bias Temperature Instability (BTI) and Process Variation (PV). Traditional reliability analysis methods, which rely on computationally intensive simulations or extensive lookup tables, fail to scale efficiently for large designs, creating a critical bottleneck in design space exploration.
arXiv:2607. 23134v1 Announce Type: new Abstract: Discovering rare safety-critical failures in autonomous and cyber-physical systems is a fundamental challenge in verification and validation.