arXiv:2607. 27251v1 Announce Type: new Abstract: Transformer-based surrogate models are increasingly used to replace expensive first-principles simulation in engineering design.
arXiv:2601. 05680v2 Announce Type: replace-cross Abstract: While Transformer-based autoregressive models excel in data generation, their token discretization strategy inherently limits their precision in continuous domains.
arXiv:2608. 12671v1 Announce Type: new Abstract: Multi-layer transformers form the critical component of essentially all large language models (LLMs) in use today.
arXiv:2510. 23472v2 Announce Type: replace-cross Abstract: Chip placement is a vital stage in modern chip design, and black-box optimization (BBO) has been applied to it for decades.
arXiv:2608. 08048v1 Announce Type: cross Abstract: This paper presents, for the first time in power systems literature to our knowledge, analytical tools to explain the training performance of machine learning surrogate models for power system dynamics.
arXiv:2608. 13260v1 Announce Type: new Abstract: Accurate modeling and forecasting of power transformer thermal behavior are critical for reliability, asset lifetime, and optimized power system operation.
arXiv:2607. 05187v1 Announce Type: new Abstract: As CMOS technology scales into the deep nanometer regime, digital circuit reliability is increasingly threatened by the combined stochastic effects of Bias Temperature Instability (BTI) and Process Variation (PV).
arXiv:2606. 15234v1 Announce Type: cross Abstract: This work presents a deterministic, machine-assisted framework for SI-compliant PCB design based on the Earth Mover's Distance (EMD).
arXiv:2602. 04940v2 Announce Type: replace Abstract: Deep learning has emerged as a transformative tool for the neural surrogate modeling of partial differential equations (PDEs), known as neural PDE solvers.
arXiv:2608. 08363v1 Announce Type: cross Abstract: Silicon carbide (SiC) power modules are increasingly deployed in automotive traction inverters, where condition monitoring is essential to prevent in-service failures.
arXiv:2603. 29268v2 Announce Type: replace Abstract: High-density through-substrate vias (TSVs) enable 2.
As CMOS technology scales into the deep nanometer regime, digital circuit reliability is increasingly threatened by the combined stochastic effects of Bias Temperature Instability (BTI) and Process Variation (PV). Traditional reliability analysis methods, which rely on computationally intensive simulations or extensive lookup tables, fail to scale efficiently for large designs, creating a critical bottleneck in design space exploration.
arXiv:2504. 03711v2 Announce Type: replace-cross Abstract: Artificial intelligence (AI)-driven electronic design automation (EDA) techniques have been extensively explored for VLSI circuit design applications.