arXiv AI By Qi Zhou, Guojun Liu, Juanhong Zhao, Guangzhi Qi, Zehao Chen, Ming Lu

EGGPlacer: Energy-Guided Generative Chip Placement with Diffusion Models

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EGGPlacer is an energy‑guided diffusion framework for macro placement that integrates analytical placement feedback and differentiable thermal feedback. By treating these signals as composable energies, the method injects them into reverse diffusion without retraining the generative model. Experiments on public benchmarks show that EGGPlacer achieves competitive mixed‑size HPWL and outperforms other methods in routed wirelength and peak temperature.

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arXiv Machine Learning
Oct 5

A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling

A new AI-accelerated iterative solver, DAIST, is introduced for 3D-IC thermal modeling. It decomposes a full-package FEM simulation into block-level subdomains, replaces each subdomain solver with a neural operator, and couples them through iterative exchanges of interfacial temperature and heat flux. This approach eliminates the need to retrain models when die count or topology changes and offers a controllable accuracy‑runtime tradeoff, achieving up to 178× speedup with minimal temperature error on tested systems.

By Yixing Li, Jiahang Zhou, Zhiyu Zeng, Xin Ai