arXiv Machine Learning October 5, 2026 By Yixing Li, Jiahang Zhou, Zhiyu Zeng, Xin Ai

A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling

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A new AI-accelerated iterative solver, DAIST, is introduced for 3D-IC thermal modeling. It decomposes a full-package FEM simulation into block-level subdomains, replaces each subdomain solver with a neural operator, and couples them through iterative exchanges of interfacial temperature and heat flux. This approach eliminates the need to retrain models when die count or topology changes and offers a controllable accuracy‑runtime tradeoff, achieving up to 178× speedup with minimal temperature error on tested systems.

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