arXiv:2608. 02965v1 Announce Type: new Abstract: Magnetic components in high-frequency, high-power-density converters are increasingly driven by non-sinusoidal flux-density waveforms with fast transitions, minor-loop operation, dc bias, and temperature variation.
By Yachao Zhu, Qiujie Huang, Sinan Li, Yang Li, Gang Lei, Jianguo Zhu
arXiv:2607. 14321v1 Announce Type: cross Abstract: Incorporating hysteresis and eddy currents into finite element simulations of laminated-core electrical machines is computationally challenging.
By Florent Purnode, Louis Denis, Fran\c{c}ois Henrotte, Gilles Louppe, Christophe Geuzaine
The paper presents a surrogate‑assisted optimization framework for designing a seven‑parameter current‑excited electromagnetic coil, coupling a 2‑D axisymmetric FEM model with a Matern 5/2 Gaussian‑process surrogate. Sequential Bayesian optimization using expected improvement (EI) is compared with COBYLA and BOBYQA, showing that the ranking of methods depends on the FEM evaluation budget and that different methods excel at early progress, terminal response, or computational cost. A retrospective study indicates no clear advantage of EI over posterior‑mean ranking on this smooth response surface, and the results are specific to the axisymmetric benchmark used.
By Yucheng Liu
arXiv:2606. 09037v1 Announce Type: new Abstract: Interior permanent magnet synchronous motor (IPMSM) design requires balancing conflicting objectives and multi-physics constraints, while modern optimization workflows face three bottlenecks: manual problem setup, high finite element analysis (FEA) cost, and unreliable surrogate-based search in sparse or out-of-distribution regions.
By Jinseong Han, Sunwoong Yang, Namwoo Kang
arXiv:2608. 08048v1 Announce Type: cross Abstract: This paper presents, for the first time in power systems literature to our knowledge, analytical tools to explain the training performance of machine learning surrogate models for power system dynamics.
By Petros Ellinas, Johanna Vorwerk, Spyros Chatzivasileiadis
arXiv:2608. 16080v1 Announce Type: new Abstract: Thermal-aware optimization of multi-die 3D integrated circuits evaluates many designs, each a costly heat-equation solve.
By Xinling Yu, Yixing Li, Ziyue Liu, Xin Ai, Zhiyu Zeng, Hai Li, Zheng Zhang